Interfacial adhesion of nano-particle silver interconnects for electronics packaging application

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1417-1423

  Joo, Sungchul ^a   Baldwin, Daniel F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION TESTING; INTERFACIAL FRACTURE ENERGIES;

ABS RESINS; ADHESION; BOND STRENGTH (MATERIALS); CHIP SCALE PACKAGES; COMPUTER NETWORKS; FRACTURE; FRACTURE ENERGY; HIGH ENERGY PHYSICS; INORGANIC COATINGS; INTERFACIAL ENERGY; METAL CLADDING; NANOPARTICLES; NANOSTRUCTURES; PACKAGING MATERIALS; POLYIMIDES; POLYMERS; SILVER; SURFACE CHEMISTRY; SURFACE ROUGHNESS; TESTING;

ELECTRONICS PACKAGING;

EID: 51449102625     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550163     Document Type: Conference Paper

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