Ultra-high aspect ratio Si nanowires fabricated with plasma etching: Plasma processing, mechanical stability analysis against adhesion and capillary forces and oleophobicity

Nanotechnology

Volumn 25, Issue 3, 2014, Pages

  Zeniou, A ^a   Ellinas, K ^a   Olziersky, A ^a   Gogolides, E ^a  

^a INSTITUTE OF MICROELECTRONICS   (Greece)

Author keywords

adhesion and capillary forces; mechanical stability; nanoscale plasma etching; oleophobicity; silicon nanowire

Indexed keywords

ADHESION; ELECTRON BEAM LITHOGRAPHY; INTERFACIAL ENERGY; MECHANICAL STABILITY; NANOWIRES; PLASMA ETCHING; SILICON; WETTING;

CAPILLARY FORCE; DEEP REACTIVE ION ETCHING; HIGH SURFACE ENERGY; MASS FLOW CONTROLLER; NANO SCALE; OLEOPHOBICITY; SI NANOWIRES (SINWS); SILICON NANOWIRES;

ASPECT RATIO;

EID: 84896501062     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/25/3/035302     Document Type: Article

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