SCOPUS 정보 검색 플랫폼

Journal of Materials Science: Materials in Electronics

Volumn 24, Issue 10, 2013, Pages 3905-3913

Phase transformation and grain orientation of Cu-Sn intermetallic compounds during low temperature bonding process

(4) Hang, Chunjin a Tian, Yanhong a Zhang, Rui a Yang, Dongsheng a

a HARBIN INSTITUTE OF TECHNOLOGY (China)

Author keywords

[No Author keywords available]

Indexed keywords

ARGON GAS ATMOSPHERES; ELECTRON BACKSCATTERING DIFFRACTION; ENERGY DISPERSIVE X-RAY; GRAIN ORIENTATION; INTERFACIAL MICROSTRUCTURE; LOW-TEMPERATURE BONDING PROCESS; REFLOW PROCESS; SOLDER JOINTS;

ARGON; BONDING; INTERMETALLICS; MOLLUSCS; PHASE TRANSITIONS; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SOLDERING ALLOYS; THREE DIMENSIONAL; TIN;

COPPER COMPOUNDS;

EID: 84890119030 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-013-1337-5 Document Type: Article

Times cited : (76)

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