Interface reaction systematics in the Cu/In-48Sn/Cu system bonded by diffusion soldering

Intermetallics

Volumn 15, Issue 7, 2007, Pages 912-917

  Sommadossi, S ^a   Guillermet, A Fernández ^b  

^a UNIVERSIDAD NACIONAL DEL COMAHUE   (Argentina)

^b CENTRO ATÓMICO BARILOCHE   (Argentina)

Author keywords

A. Intermetallics, miscellaneous; B. Phase identification; B. Phase transformations; C. Joining; D. Phase interfaces

Indexed keywords

ELECTRON DIFFRACTION; ELECTRON PROBE MICROANALYSIS; HEAT RESISTANCE; INTERMETALLICS; PHASE INTERFACES; PHASE TRANSITIONS; SOLDERING; SOLDERING ALLOYS; SURFACE CHEMISTRY; TRANSMISSION ELECTRON MICROSCOPY;

DIFFUSION SOLDERING; PHASE IDENTIFICATION; THERMAL STABILITY TESTS;

COPPER COMPOUNDS;

EID: 34247162138     PISSN: 09669795     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.intermet.2006.10.050     Document Type: Article

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