Influence of solder thickness on interfacial structures and fatigue properties of Cu/Sn/Cu joints

Materials Science and Technology

Volumn 15, Issue 7, 1999, Pages 851-856

  Kato, H ^a   Horikawa, S ^a,b   Kageyama, K ^a  

^a SAITAMA UNIVERSITY   (Japan)

^b EAST JAPAN RAILWAY COMPANY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0003081281     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/026708399101506508     Document Type: Article

References (11)

1. P. L. TU, Y. C. CHAN, and J. K. L. LAI: IEEE Trans. Component. Packag. Manuf. Technol., Part B, 1997, 20, 87-93.
2. M. NYLÈN and S. NORGREN: Solder. Surf. Mt Technol., 1990, 5, (June), 15-20.
3. E. P. BUSSO, M. KITANO, and T. KUMAZAWA: J. Electronic Packag., 1994, 116, 6-15.
4. Y. UEGAI, S. TANI, S. YOSHIOKA, J. HIROTA, and A. INOUE: J. Soc. Mater. Sci. Jpn, 1991, 40, 1324-1329.
5. T. KUMAZAWA, M. OXIZAWA, R. KONO, M. KITANO, and K. NISHI: J. Jpn Inst. Interconnecting Electronic Circuits, 1997, 12, 413-417.
6. DAPING YAO and J. K. SHANG: Metall. Mater. Trans. A, 1995, 26A, 2677-2685.
7. JIAN KU SHANG and DAPING YAO: Proc. ASME Int. Mechanical Engineering Cong. Expo., San Francisco, CA, November 1995, ASME, 1-6.
8. J. W. MORRIS, Jr, G. GRIVAS, D. TRIBULA, T. SUMMERS, and D. FREAR: Solder. Surf. Mt Technol., 1989, 3, (October), 4-20.
9. D. S. DUNN, T. F. MARINIS, W. M. SHERRY, and C. J. WILLIAMS: in 'Electronic packaging materials science', (ed. E. A. Giess et al.), MRS Symp. Proc., Vol. 40, 129-138, 1985, Pittsburgh, PA, Materials Research Society.
10. E. K. OHRINER: Weld. Res., 1987, 66, 191s-202s.
11. M. HARADA and R. SATOH: Proc. 40th Conf. on 'Electronic components and technology', Las Vegas, NV, May 1990, IEEE, Vol. 1, 510-517.