Characterization and modelling of solder joint reliability

Solid Mechanics and its Applications

Volumn 141, Issue , 2006, Pages 377-468

  Dudek, R ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

Board level test validation; Coffin manson; Finite Element simulations; Primary and secondary creep; Reliability predictions; Solder creep; Solder fatigue; Solder plasticity

Indexed keywords

CHIP SCALE PACKAGES; CREEP; FORECASTING; LEAD-FREE SOLDERS; MICROELECTRONICS; RELIABILITY; SURFACE MOUNT TECHNOLOGY; THERMAL FATIGUE;

COFFIN-MANSON; FINITE ELEMENT SIMULATIONS; RELIABILITY PREDICTION; SECONDARY CREEP; SOLDER FATIGUE; TEST VALIDATION;

FINITE ELEMENT METHOD;

EID: 84884835104     PISSN: 09250042     EISSN: None     Source Type: Book Series    
DOI: 10.1007/1-4020-4935-8_7     Document Type: Article

References (74)

1. Dudek, R., Lead-free Solder Interconnects: Characterization, Testing and Reliability, 3rd Int. Conf. on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (σSIME), Paris, France, April 15-17, 2002, Proc. pp. 62-72.
2. Lau, H. (ed.), Solder Joint Reliability, Van Nostrand Reinhold, New York, 1991.
3. Lau, J.H. and Pao, Y.-H., Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies, McGraw-Hill, 1997.
4. Frear, D.R., Burchett, S.N., Morgan, H.S., Lau, J.H. (eds), The Mechanics of Solder Alloy Interconnects. Van Nostrand Reinhold. New York. 1994. pp. 60.
5. Lau, J.H., Thermal Stress and Strain in Microelectronics Packaging, Van Nostrand Reinhold, 1993.
6. Manson, S.S., Thermal Stress and Low-Cycle Fatigue, McGraw-Hill, New York, 1966.
7. Engelmaier, W., Functional Cycles and Surface Mounting Attachment Reliability, Circuit World, Vol. 11, No. 3 (1985), pp. 61-72.
8. Wild, R.N., Some Fatigue Properties of Solders and Solder Joints IBM Techn. Rep. No. 73Z000421, January 1973.
9. Engelmaier, W., Turbini L.J., Design for Reliability, A White Paper for SM and Related Technologies for the Surface Mount Council, Mendharnl Atlanta, 1995, presented at Workshop Reliability of SMT-Solder Joints, Berlin, October 1996.
10. Clech, J.-P., Solder Reliability Solutions: a PC-based design-for-reliability tool, Proceedings, Surface Mount International Conference, Sept. 8-12, 1996, San Jose, CA, Vol.1, pp. 136-151.
11. Clech, j-P., Assessing the Solder Joint Reliability of Fine Pitch SMT, BGA, Flip-Chip and CSP Assemblies, Course, SMT Nueremberg, June 1998.
12. de Kluizenaar, E.E., Reliability of Soldered Joints, Tutorial for the 5th International Conference on Interconnection Technology in Electronics, Fellbach, February 1990.
13. Norris, K.C., Landzberg, A.H., Reliability of Controlled Collapse Interconnections, IBM Journal of Research and Development, May 1969, pp. 266-27 1.
14. Clech, J.-P., Handwerker, C., Review and analysis of lead-free solder material properties BGA, Flip-Chip, ESPI Inc., NIST, August 20, 2002.
15. Biglari, M.H., Oddy, M., Oud, M.A., Davis, P., Pb-Free Solders Based on SnAgCu, SnAgBi, SnCu and SnCu for Wave Soldering of Electronic Assemblies, Proc. Electronics Goes Green 2000 ,Berlin, Germany, Sept. 11-13, 2000, pp. 73-82.
16. [lo] Neu, R.W., Scott, D.T., and Woodmansee, MW., Thermomechanical behaviour of 965n-4Ag and Castin Alloy, ASME Transactions, Journal of Electronic Packaging, Vol. 123, No.3, September2001, pp. 238-246.
17. Darveaux, R., Banerji, K., Mawer, A. and Dody, G., Reliability of plastic ball grid array assemblies, Chap. 13, Ball Grid Array Technology, ed. J.H. Lau, McGraw-Hill, 1995, pp. 379-442.
18. Lau, J.H., Chang, Ch., TMA, DMA, DSC, and TGA of Lead Free Solders, 48th ECTC Electronics Components & Technology Conf., Seattle, Washington, USA, May 25-28, 1998, pp. 1339-1344.
19. Grivas, D., Murty, K.L., Morris, Jr., J.W., Deformation of Pb-Sn eutectic alloys at relatively high strain rates, Acta Metallurgica, 27, 1979, pp. 731-737.
20. Weertman, J., J. AppI. Phys. 26, 1213 (1955), 27, 832 (1956), 28, 1185 (1957).
21. Bird, J.E., Mukherjee, A.K., Dorn, J.E., Israel Univ. Press (1969) 255.
22. Schubert, A., Walter, H., Dudek, R., Michel, B., Lefranc, G., Otto, J. and Mitic G., Thermomechanical properties and creep deformation of lead-containing and lead-free solders, Proceedings, 2001 International Symposium on Advanced Packaging Materials, pp. 129-134.
23. Knecht, S., Integrated Matrix Creep: Application to Lifetime Prediction of Eutectic Tin- Lead Solder Joints, Proceedings of Mat. Res. Soc. Symp., Vol. 203, 1991 Materials Research Society.
24. Hacke, P.L., Sprecher, A.F., Conrad, H., ASTM Symposium Thermomechanical Fatigue Behaviour of Materials, San Diego, 1991, ASTM STP 1186, 1993.
25. Hacke, P.L., Sprecher, A.F., Conrad, H., in Thermal Stress and Strain in Microelectronics Packaging, 1993, edited by J. H. Lau, pp. 467-499.
26. Knecht, S., Fox, L., Integrated Matrix Creep: Application to Accelerated Testing and Lifetime Prediction, in Lau, H. (ed.), Solder Joint Reliability, Van Nostrand Reinhold, New York, 1991, pp. 508-544.
27. Darveaux, R. and Banerji, K., Constitutive relations for tin-based solder joints, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15, No. 6, Dec. 1992, pp. 1013-1024.
28. Schubert, A., Dudek, R., Doring, R., Walter, H., Auerswald, E., Gollhardt, A., Schuch, B., Sitzmann, H., Michel, B., Lead-free Solder Interconnects: Characterization, Testing and Reliability, 3rd Int. Conf. on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (σSIME), Paris, France, April 15-17, 2002, Proc. pp. 62-72.
29. Kariya, Y. and Plumbridge, Wi., Mechanical properties of Sn-3.Omass%Ag-0.Smass% Cu alloy, Proceedings, 7th Symposium on Microjoining and Assembly Technology in Electronics, Yokohama, Japan, Feb. 1-2, 2001, pp. 383-388.
30. Amagai, M., Mechanical reliability in electronic packaging, Microelectronics Reliability 42, 2002, pp. 607-627.
31. Wiese, S., Meusel, E., Wolter, K.-J., Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders, Proceedings, 53rd Electronic Components & Technology Conference, 2003, pp. 197-206.
32. Lau, J. H., Dauksher, W., Vianco, P., "Acceleration models, constitutive equations, and reliability of lead-free solders and joints", Proceedings, 54th Electronic Components & Technology Conference, 2003, pp. 229-236.
33. Vianco, P., Rejent, J., Compression Deformation Response of 95.55n-3.9Ag-0.6Cu Solder, UCLA Lead-Free Workshop, October 2002.
34. Zhang, Q., Dasgupta, A., Haswell, P., Viscoplastic constitutive properties and energy- partitioning model of lead-free 5n3,9AgO.6Cu solder alloy, Proceedings, 53rd Electronic Components & Technology Conference, 2003, pp. 1862-1868.
35. Clech, J.-P., Lead-free solder joint reliability, ESPI Inc., Workshop held at IPC JEDEC 4111 Int. ConE on Lead-Free Electronic Components and Assemblies, Frankfurt, Germany, Oct. 2003.
36. Pang, J.H.L., Design for Reliability Test and Analysis for Pb-free Solders, in B. Michel, R. Aschenbrenner: The World of Electronic Packaging and System Integration, IZM special edition, ddp goldenbogen, Dresden, 2004, pp. 359-366.
37. Pang, J.H.L., Xiong, B.S., Neo, C.C., Zhang, X.R. and Low, T.H., Bulk Solder and Solder Joint Properties for Lead Free SnAgCu Solder Alloy, Proceedings, 53rd Electronic Components & Technology Conference, 2003, pp. 673-679.
38. NIST-Boulder database, Database for Solder Properties with Emphasis on New Leadfree Solders, Properties of Lead-Free Solder, Release 4.0, 2003, by Siewers, T., Liu, S., Smith D.R., Madeni J.C., National Institute of Standards and Technology, Colorado School of Mines, available at http: www.boulder.nist.gov div83S
39. Clech, J.-P., An Obstacle-Controlled Creep Model for Sn-Pb and Sn-Based Lead-Free Solders, Proc. SMTAI Conference, September 2004, Chicago, USA.
40. Schubert, A., Dudek, R.. E. Auerswald, A. Gollhardt, B. Michel, H. Reichi, "Fatigue Life Models for SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulation", Proceedings, 53rd Electronic Components & Technology Conference, 2003, pp. 603-610.
41. Deplanque, S., Nuechter, W., Spraul, M. Wunderle, B., Dudek, R., Michel, B., Relevance of Primary Creep in Thermo-Mechanical Cycling for Life-Time Prediction in Sn-Based Solders, Proceedings, 6th EuroSimE Conference, Berlin, Germany, April 2005.
42. Schubert, A., Dudek, R., Doring, R., Walter, H., Auerswald, E., Gollhardt, A., Schuch, B., Sitzmann, H., Michel, B., Lead-free Solder Interconnects: Characterization, Testing and Reliability, 3rd Int. Conf. on Benefiting from Thermal and Mechanical Simulation in (Micro)-Electronics (σSIME), Paris, France, April 15-17, 2002, Proc. pp. 62-72.
43. Mayuzumi, M., Onchi, T., Creep Deformation and Rupture Properties of Unirradiated Zircaloy-4 Nuclear Fuel Cladding Tube at Temperatures of 727 to 857 K, Journal of Nuclear Materials, 175 (1990), pp. 135-142.
44. Clech, J.-P., "An Extension of the Omega Method to Primary and Tertiary Creep of Lead-Free Solders", Proc. 55th ECTC Electronics Components & Technology Conf., Lake Buena Vista, USA, May 2005.
45. R. Dudek, M. Nylen, A. Schubert, B. Michel, and H. Reichl, An Efficient Approach to Predict Solder Fatigue Life and its Application to SM- and Area Array Components, Proc. of ECTC 47, San Jose, May 1997, pp. 462-471.
46. Akisanya, A.R., Meng, CS., Initiation of Fracture at the Interface Corner of BiMaterials Joiiits., Jouii. of the Mechanics arid Physics of Solids 51, 2003, pp. 27-46.
47. Scherzer, M., Non-Linear Deformed Interface Corner Stress Characterization by Effective Parallel Numerical Methods in: B.L. Karihaloo, Y.W. Mai, MI. Ripley, R.O. Ritchie (eds.): Advances in Fracture Research, Proceedings of the Ninth International Conference on Fracture, Vol. 4, April 1997, Sydney, Australia, Pergamon Press, Amsterdam, Oxford, New York, 1997, pp. 1959-1970.
48. Lau, J.H., Shangguan, D., Lau, D., Kung, T., Lee, R., Thermal-Fatigue Life Prediction Equation for Wafer-Level Chip Scale Packages (WLCSP) Lead-Free Solder Joints on Lead-Free Printed Circuit Board, Proceedings, 53rd Electronic Components & Technology Conference, 2004, pp. 1563-1569.
49. Lau, J.H., Design for Reliability of Lead-Free Solder Joints, in B. Michel, R. Aschenbrenner, The World of Electronic Packaging and System Integration, IZM special edition, ddp goldenbogen, Dresden, 2004, pp. 120-127.
50. Syed, A.R., Factors Affecting Creep-Fatigue Interaction in Eutectic Sn Pb Solderr Joints, Advances in Electronic Packaging, InterPack97 (1997), pp. 1535-1542.
51. Syed, A.R., Predicting Solder Joint Reliability for Thermal, Power, & Bend Cycle within 25°c Accuracy, 51 ECTC, 2001, pp. 255-263.
52. Syed, A.R., Accumulated Creep Strain and Energy Density Based Thermal Fatigue Life Prediction Models for SnAgCu Solder Joints, 54 ECTC, Las Vegas, June 2004, pp. 73 7-746.
53. Dasgupta, A., Oyan, C., Barker, D., Pecht, M., Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach, ASME Journ. of Electronic Packaging, Vol. 114, No. 2, (1991), pp. 152-160.
54. Frear, D.R., Burchett, SN., Neilsen, M.K., Life Prediction Modeling of Solder Interconnects for Electronic Systems, ASME EEP-vol. 19-2, Advances in electronic packaging, 20997) pp. 1515-1522.
55. Desai, CS., Review and Evaluation of Approaches for Thermomechanical Analysis for Stress, Failure and Reliability, ASME EEP-vol. 26-2, Advances in electronic packaging, 20999), pp. 1713-1740.
56. Qian, Z., Ren, W., Liu, S., A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys, ASME Transactions, Journal of Electronic Packaging, Vol. 121, September 1999, pp. 162-168.
57. Chandaroy, R., Barasan, C., Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading, ASME Journ. of Electronic Packaging, Vol. 121, June 1999, pp. 61-68.
58. Barasan, C., Chandaroy, R., Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading, ASME Journ. of Electronic Packaging, Vol. 124, March 2002, pp. 60-67.
59. Zhang, X., Lee, S.-W.R., Pao, Y.-H. A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints. ASME Journ. of Electronic Packaging, Vol. 122, 2000, pp. 200-206.
60. Subbarayan, G., Towashiraporn, P., A Hybrid Fracture-Damage Model for Computationally Efficient Fracture Simulations, Proc. 5th EPTC, Signapore, Dec. 2003, pp. 462-469.
61. Abdul-Baqi, A., Schreurs, P.J.G., Geers, M.G.D., Fatigue Damage Modellling in Solder Interconnections: a Cohesive Zone Approach. Proc. 3rd EuroSimE, Aix-en-Provence, France, April 2003, pp. 235-239.
62. Sharma, P., Dasgupta, A., Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling-Part I: Formulation, ASME Journ. of Electronic Packaging, Vol. 124, Sept. 2002, pp. 292-297.
63. Sharma, P., Dasgupta, A., Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling-Part II: Mechanistic Insights arid Cyclic Durability Predictioiis From Monotonic Data, ASME Journ. of Electronic Packaging, Vol. 124, Sept. 2002, pp. 298-304.
64. Mueller, W.H.,Understanding Morphology Changes in Solders. Proc. 3rd EuroSimE, Aix-en-Provence, France, April 2003, pp. 479-484.
65. Ubachs, R.L.J.M., Schreurs, P.J.G., Geers, M.G.D., Microstructural Behaviour of Solder Alloys, Proc. 5th EuroSimE, Brussels, Belgium, May 2004, pp. 543-548.
66. Ferry, J.D., Viscoelastic Properties of Polymers, John Wiley & Sons, New York, 1980.
67. Dudek, R., Schubert, A., Michel, B., Nonlinear FE Simulation for Plastic Packaging Applications, Second Workshop Mechanical Reliability of Polymeric Materials and Plastic Packages of IC Devices POLY'99, Paris, France, Dec. 12-15, 1999.
68. Hall, P.M., Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards, IEEE Transact. on Components, Hybrids, and Manufacturing Technol.,Vol. CHMT-7, No. 4, Dec. 1984, pp. 314-327.
69. A. Picault, J. F. Autissier, Comparison of Fatigue Life Prediction Based on Numerical Simulation to Testing Results, (in French) Internal report, Jabil Circuit, Meung sur Loire, France, June 2004.
70. Dudek, R., R. Doring, B. Michel, A. Picault, J. F. Autissier,Thermo- mechanical Reliability Analyses on Solder Joints of Ceramic Components, Proceedings IPC Soldertec, Barcelona, Spain, June 2005.
71. R. Dudek, R. Doering, B. Michel, G. Petzold, J. Albrecht, C. Wieand, S. Kuhn, "Investigations on the Reliability of Lead-Free CSPs Subjected to Harsh Environments", Proceedings ITherm 2004, Las Vegas, USA, June 2004.
72. A. Schubert, R. Dudek, R. Leutenbauer, P. Coskina, K.-F. Becker, J. Kloeser, B. Michel, H. Reichl, D. Baldwin, J. Qu, S. Sitaraman, C.P. Wong, R. Tummala, Numerical and Experimental Investigations of Large IC Flip Chip Attach, 50th Electronic Components & Technology Conf. (ECTC) Las Vegas, USA, May 2000.
73. Schubert, A., Dudek, R., Vogel, D., Becker, K.-F., Kloeser, J., Michel, B., Reichi, H., Flip Chip Solder Joint Reliability, Proc. Symposium on Advances in Packaging (APACK '99), December 8-10, 1999, Singapore, pp. 234-242.
74. Dudek, R., Schubert, A., Michel, B., Analysis of Flip Chip Attach Reliability, Internat. Conference Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000, Proc. pp 77-85.