Microstructural behaviour of solder alloys

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Volumn , Issue , 2004, Pages 543-547

  Ubachs, R L J M ^a   Schreurs, P J G ^a   Geers, M G D ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIBILITY OF SOLIDS; COMPUTER SIMULATION; CRACK INITIATION; DEFORMATION; ELASTICITY; FREE ENERGY; MACHINE DESIGN; MATHEMATICAL MODELS; METALLOGRAPHIC MICROSTRUCTURE; RANDOM PROCESSES; SOLIDIFICATION; SURFACE TENSION; THERMAL CYCLING;

CRACK NUCLEATION; MASS FRACTION FIELDS; THERMOMECHANICAL LOADING;

SOLDERING ALLOYS;

EID: 3843076298     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. Basaran, C., Desai, C. and Kundu, T. [1998a], 'Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept. Part I: Theory and formulation', Journal of Electronic Packaging 120(1), 41-47.
2. Basaran, C., Desai, C. and Kundu, T. [1998b], 'Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept. Part II: Verification and application', Journal of Electronic Packaging 120(1), 48-54.
3. Brandon, D. [1994], 'Nonlocal superconductivity', Zeitschrift für angewandte Mathematik und Mechanik 45, 135-152.
4. Frear, D. [1989], 'Thermomechanical fatigue of solder joints: A new comprehensive test method', IEEE Transactions on Composites, Hybrids, and Manufacturing Technology 12(4), 492-501.
5. Frear, D., Burchet, S., Neilsen, M. and Stephens, J. [1997], 'Microstructurally based finite element simulation on solder joint behaviour', Soldering and Surface Mount Technology 9(1), 39-42.
6. Frear, D., Grivas, D. and Morris, Jr., J. [1988], 'A microstructural study of the thermal fatigue failures of 60Sn-40Pb solder joints', Journal of Electronic Materials 17, 171-180.
7. Giacomin, G. and Lebowitz, J. [1997], 'Phase segregation dynamics in particle systems with long range interactions. I. Macroscopic limits', Journal of statistical Physics 87(1), 31-61.
8. Hacke, P., Sprecher, A. and Conrad, H. [1998], 'Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints', Journal of Electronic Materials 26(7), 774-782.
9. Ju, S., Kuskowski, S., Sandor, B. and Plesha, M. [1994], Creep-fatigue damage analysis of solder joints, in S. Schroeder and M. Mitchell, eds, 'Fatigue of electronic materials, STP-1153', American Society for Testing and Materials, Philadelphia, pp. 1-21.
10. Kanchanomai, C., Miyashita, Y. and Mutoh, Y. [2002], 'Low cycle fatigue behavior and mechanisms of a eutectic Sn-Pb solder 63sn/37pb', International Journal of fatigue 24, 671-683.
11. Matin, M., Vellinga, W. and Geers, M. [2003], Quantitative microscopy of microstructural evolution in eutectic solders subjected to static thermal load, in L. Ernst, G. Zhang, R. Dudek and O. de Saint Leger, eds, 'Thermal and Mechanical Simulation and Experiments in Micro-Electronics and Micro-Systems', EuroSIME 2003, Shaker Publishing, pp. 111-116.
12. Peerlings, R., de Borst, R., Brekelmans, W. and de Vree, J. [1996], 'Gradient enhanced damage for quasi-brittle materials', International Journal for Numerical Methods in Engineering 39(19), 3391-3403.
13. Peerlings, R., Geers, M., de Borst, R. and Brekelmans, W. [2001], 'A critical comparison of nonlocal and gradient-enhanced continua', International Journal of Solids and Structures 38, 7723-7746.
14. Perzyna, P. [1966], Fundamental problems in visco-plasticity, in 'Recent Advances in Applied Mechanics', Academic Press, New York.
15. Zhao, J., Miyashita, Y. and Mutoh, Y. [2001], 'Fatigue crack growth behavior of 96.5Sn-3.5Ag lead-free solder', International Journal of Fatigue 23, 723-731.