A damage evolution model forthermal fatigue analysis of solder joints

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 3, 2000, Pages 200-206

  Zhang, Xiaowu ^a   Ricky Lee, S W ^b   Pao, Yi Hsin ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^c VISTEON CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039896326     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.1286121     Document Type: Article

References (17)

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