Acceleration models, constitutive equations, and reliability of lead-free solders and joints

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 229-236

  Lau, John ^a   Dauksher, Walter ^a   Vianco, Paul ^b  

^a AGILENT TECHNOLOGIES   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; COPPER; CREEP; LEAD; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; PROBABILITY; RELIABILITY; SOLDERED JOINTS;

CONSTITUTIVE EQUATIONS; CUMULATIVE DISTRIBUTION FUNCTION; LIFE DISTRIBUTION; PLASTIC BALL GRID ARRAY;

ELECTRONICS PACKAGING;

EID: 0038109900     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)

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