A damage coupling framework of unified viscoplasticity for the fatigue of solder alloys

Journal of Electronic Packaging, Transactions of the ASME

Volumn 121, Issue 3, 1999, Pages 162-168

  Qian, Z ^a   Ren, W ^a   Liu, S ^a  

^a Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0348098805     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792679     Document Type: Article

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