Analyses of flip chip attach reliability

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 77-85

  Dudek, R ^a   Schubert, A ^a   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

Application software; Assembly; Fatigue; Finite element methods; Flip chip; Optimization; Parametric study; Polymers; Temperature; Thermomechanical processes

Indexed keywords

APPLICATION PROGRAMS; ASSEMBLY; CHARACTERIZATION; CHIP SCALE PACKAGES; COATINGS; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; JOINING; MANUFACTURE; OPTIMIZATION; PLASTIC COATINGS; POLYMERS; TEMPERATURE; TENSILE TESTING; VISCOELASTICITY;

ENVIRONMENTAL CONDITIONS; FLIP CHIP; PACKAGING TECHNOLOGIES; PARAMETRIC STUDY; PERFORMANCE OPTIMIZATIONS; THERMO-MECHANICAL BEHAVIORS; THERMO-MECHANICAL DESIGN; THERMOMECHANICAL PROCESS;

FINITE ELEMENT METHOD;

EID: 84952326162     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860577     Document Type: Conference Paper

References (8)

1. R. Dudek; D. Vogel; B. Michel: Mechanical Failure in COB-Technology Using Glob-Top Encapsulation IEEE Trans. Comp., Packag., Manufact. Technol.-Part C, Vol. 19, no. 4, Oct. 1996, pp 232-240
2. ABAQUS Theory Manual (V. 5.7), Hibbitt, Karlsson and Sorensen, Inc., Providence, RI, 1997
3. Schubert, A.; Dudek, R.; Vogel, D.; Michel, B.; Reichl, H.: Materials Mechanics and Mechanical Reliability of Flip Chip Assemblies on Organic Substrates, Advancing Microelectronics, 24 (1997) 4, pp. 29-32.
4. R. Dudek, M. Nylen, A. Schubert, B. Michel, and H. Reichl: An Efficient Approach to Predict Solder Fatigue Life and its Application to SM- and Area Array Components Proc. of ECTC 47, San Jose, May 1997, pp. 462-471
5. th Int. Symp. On Advanced Packaging Materials, Braselton, GA, March 15-18, 1998, pp. 153-160
6. A. Schubert, R. Dudek, D. Vogel, K. F. Becker, J. Kloeser, B. Michel, and H. Reichl: Flip Chip Solder Joint Reliability Proc. APAC 99, Singapore, December 1999
7. D. Vogel, J. Auersperg, A. Schubert, B. Michel, H. Reichl: Deformation analysis on flip chip solder interconnects by microDAC, Proc. of Reliability of Solders and Solder Joints Symposium at 126th TMS Annual Meeting & Exhibition, Feb. 9-13, 1997, Orlando, USA, in "Design & Reliability of Solders and Solder Interconnects", ed. by R.K. Mahidhara, TMS Publication Cat. No. 96-80433, pp. 429-438
8. th ECTC Electronics Components & Technology Conf., Las Vegas, USA, May 21-24, 2000, Proc. in print