Relevance of primary creep in thermo-mechanical cycling for life-time prediction in Sn-based solders

Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005

Volumn 2005, Issue , 2005, Pages 71-78

  Deplanque S ^a   Nuchter W ^a   Spraul, M ^a   Wunderle, B ^b   Dudek, R ^b   Michel, B ^b  

^a ROBERT BOSCH GMBH   (Germany)

^b Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CREEP; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; THERMAL CYCLING; TIN;

CYCLIC LOADING; FATIGUE LOAD; THERMO-MECHANICAL CYCLING;

SOLDERING ALLOYS;

EID: 33745698161     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2005.1502777     Document Type: Conference Paper

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