Numerical and experimental investigations of large ic flip chip attach

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1338-1346

  Schubert, A ^a   Dudek, R ^a   Leutenbauer, R ^a   Coskina, P ^a   Becker, K F ^a   Kloeser, J ^a   Michel, B ^a   Reichl, H ^a   Baldwin, D ^b   Qu, J ^b   Sitaraman, S ^b   Wong, C P ^b   Tummala, R ^b  

^a FRAUNHOFER IZM   (Germany)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MATHEMATICAL MODELS; NUMERICAL METHODS; SEMICONDUCTING SILICON; SOLDERED JOINTS; THERMAL CYCLING; THREE DIMENSIONAL;

COEFFICIENT OF THERMAL EXPANSION; FLIP CHIP ATTACH; SILICON DIES;

INTEGRATED CIRCUIT TESTING;

EID: 0034484439     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)