Micro-mechanics of creep-fatigue damage in PB-SN solder due to thermal cycling - Part II: Mechanistic insights and cyclic durability predictions from monotonic data

Journal of Electronic Packaging

Volumn 124, Issue 3, 2002, Pages 298-304

  Sharma, Pradeep ^a   Dasgupta, Abhijit ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042871628     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1493203     Document Type: Article

References (12)

1. Sharma, P., and Dasgupta, A., 2002, "Micro-Mechanics Of Creep-Fatigue Damage In Pb-Sn Solder Due To Thermal Cycling: Part I (Formulation)," ASME J. Electron. Packag., published in this issue, pp.
2. Sharma, P., 2000, Ph.D. dissertation, Dept. of Mechanical Engineering, University of Maryland, College Park.
3. Sharma, P., and Dasgupta, A., submitted to the Journal of Applied Physics.
4. Sharma, P., and Dasgupta, A., 2001, ASME J. Eng. Mater. Technol.
5. Cocks, A. C. F., and Ashby, M. F., 1982. "On creep fracture by void growth," Prog. Mater. Sci., 27, pp. 189-244.
6. Dasgupta, A., Oyan, C., Barker, D., and Pecht, M., 1992, "Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach," ASME J. Electron. Packag., 144, pp. 152-160.
7. Darbha, K., Okura, J., Shetty, S., Dasgupta, A., Reinikainen, T., Zhu, J., and Caers, J., 1999, ASME J. Electron. Packag., 121, pp. 237-242.
8. Frear, D. R., Burchett, S. N., and Rashid, M. M., 1995, "A microstructurally based model of solder joints under conditions of thermomechanical fatigue," Advances in Electronic Packaging 1995, Proceedings of the International Electronic Packaging Conference-INTERpack '95 p. 2 vol. xvi+1320, 347-60, vol. 1.
9. Frear, D. R., Burchett, S. N., and Rashid, M. M., 1995, "A microstructurally based model of solder joints under conditions of thermomechanical fatigue," Advances in Electronic Packaging 1995, Proceedings of the International Electronic Packaging Conference-INTERpack '95 p. 2 vol. xvi+1320, 347-60, vol. 1.
10. Upadhyayula, K. S., 1998, Ph.D. dissertation, Dept. of Mechanical Engineering, University of Maryland, College Park.
11. Okura, J. H., and Dasgupta, A., 1999, "Effect of High Temperature Aging on Solder Joint Degradation in FCOB Assemblies," Imerpack99, ASME, June.
12. Onck, P., and van der Giessen, E., 1998, "Micromechanics of creep fracture: simulation of intergranular crack growth," Comput. Mater. Sci., 13(1-3), pp. 90-102.