Factors affecting creep-fatigue interaction in eutectic Sn/Pb solder joints

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1535-1542

  Syed, Ahmer R ^a  

^a DELPHI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0343326925     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (20)

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2. Aldrich, J. W., and Avery, D. H., 1970, "Alternating Strain Behavior of a Superplastic Metal," Proceedings of the 16th Sagamore Army Material Research Conference, 1969, Syracuse University Press, pp/ 397-416.
3. Attarwala, A. I., Tien, J. K., Masada, G. Y., and Dody, G., 1992, "Confirmation of Creep and Fatigue Damage in Pb/Sn Solder Joints," ASME J. of Electronic Packaging, No. 2, pp. 109-111.
4. Darveaux, R., and Banerjee, K., 1992, "Constitutive Relations for Tin-Based Solder Joints," IEEE CHMT-15, No. 6, pp. 1013-1024.
5. Darveaux, R., 1995, "Optimizing the Reliability of Thin Small Outline Package (TSOP) Solder Joints," Advances in Electronic Packaging, ASME, Vol. 2, 675-685.
6. Darveaux, R., 1996, Private Communication
7. Frear, D., Grivas, D., and Morris, J. W., 1989, "Parameters Affecting Thermal Fatigue Behavior of 60Sn-40Pb Solder Joints," J. of Electronic Materials, No. 6, pp. 671-680.
8. Frear, D. R., and Jones, W. B., 1990, "Cyclic Deformation of 60Sn-40Pb Solder Joints During Thermomechanical Fatigue," Proceedings of NEPCON, pp. 1340-1352.
9. Lee, S. M., and Stone, D. S., 1992, "Deformation and Fracture of Pb-Sn Eutectic Under Tensile and Fatigue Loading," ASME J. of Electronic Packaging, No. 2, pp. 118-121.
10. Logsdon, W. A., Liaw, P. K., and Burke, M. A., 1990, "Fracture Behavior of 63Sn-37Pb Solder," Engineering Fracture Mechanics, No. 2, pp. 183-218.
11. Mawer, A., Cho, D., and Darveaux, R., 1996, "The Effect of PBGA Solder Pad Geometry on Solder Joint Reliability," Proceeding of Surface Mount International, pp. 127-135.
12. Popelar, S., Erickson, C., and Yen, S., "A Methodology for Generating Thermal Cycling Fatigue Models for Flip Chip Solder Alloys," Proceedings of the 1996 International Flip Chip, Ball Grid Array, TAB and Advanced Packaging Symposium, pp.118-125.
13. Satoh, R., Arakawa, K., Harada, M., and Matsui, K., 1991, "Thermal Fatigue Life of Pb-Sn Alloy Interconnections," IEEE CHMT-14, No. 1, pp. 224-232.
14. Solomon, H., D., 1988, "Low Cycle Fatigue," ASTM-STP 942, pp. 342-371.
15. Syed, A. R., Banerjee, B. K., Bhatti, P., Gschwend, K., and Kwang, A., 1993, "Effect of Temperature Profile Parameters on Creep Response of Solder Joints in Leaded Surface Mount Devices," Proceedings of the 1993 ASME International Electronic Packaging Conference, Vol. 2, pp. 1055-1062.
16. Syed, A. R., 1995, "Creep Crack Growth Prediction of Solder Joints During Temperature Cycling - An Engineering Approach," ASMEJ. of Electronic Packaging, No. 2, pp. 116-122.
17. Syed, A. R., 1997, "Solder Joint Life Prediction Model and Application to Ball Grid Array Design Optimization," to be published in the Proceedings of Experimental/Numerical Methods in Electronic Packaging, SEM.
18. Syed, A. R., 1997, "ACES of Finite Element and Life Prediction Models for Solder Joint Reliability," to be published in the proceedings of 1997 TMS Conference, Orlando, Florida.
19. Tribula, D., Grivas, D., Frear, D. R., and Morris, J. W., 1988, "Observations on the Mechanisms of Fatigue in Eutectic Pb-Sn Solder Joints," ASME Winter Meeting, Chicago, 1988.
20. Wong, B., Helling, D. E., and Clark, R. W., 1988, "A Creep-Rupture Model for Two-Phase Eutectic Solders," IEEE CHMT-11, No.3,pp.284-290.