An extension of the omega method to primary and tertiary creep of lead-free solders

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1261-1271

  Clech, Jean Paul ^a  

^a EPSI Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; LEAD ALLOYS; RELIABILITY; STRAIN; STRESS ANALYSIS;

OMEGA METHOD; PHENOMENOLOGICAL MODEL; SN-BASED SOLDERS; TERTIARY CREEP;

SOLDERING ALLOYS;

EID: 24644523796     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. Clech, J.-P., "An obstacle-controlled creep model for Sn-Pb and Sn-based lead-free solders", Proceedings (CD-ROM), SMTA International Conference (SMTAI'04), Chicago, IL., September 26-30, 2004 (available for download at: http://www.jpclech.com).
2. Dušek, M. and Hunt, C., "Measurement of materials properties of lead-free solders for modeling requirements", Proceedings (CD-ROM), SMTA International Conference, Chicago, IL, September 21-25, 2003.
3. Huang, M. L. and Wang, L., "Creep behavior of eutectic Sn-Ag lead-free solder alloy", Materials Research Society, Journal of Materials Research, Vol. 17, No. 11, November 2002, pp. 2897-2903.
4. Kariya, Y., Otsuka, M. and Plumbridge, W. J., "The constitutive creep equation for a eutectic Sn-Ag alloy using the modified theta-projection concept", Journal of Electronic Materials, Vol. 32, No. 12, December 2003, pp. 1398-1402.
5. Lu, W-Y., Lim, J., Boyce, B. L., Grazier, J. M. and Fang, H. E., "Small-scale multiaxial deformation experiments on solder for high-fidelity model development", Sandia Report, SAND2002-8592, Sandia National Laboratories, Albuquerque, NM, December 2002.
6. Mei, Z. and Morris, Jr., J. W., "Characterization of eutectic Sn-Bi solder joints", Journal of Electronic Materials, 1992, Vol. 21, No. 6, pp. 599-607.
7. Monkman, F. C. and Grant, N. J., "An empirical relationship between creep rupture life and minimum creep rate in creep rupture tests", Proceedings, American Society for Testings and Materials, Vol. 56, 1956, pp. 593-620.
8. Pao, Y. H. and Marin, J., "Analytical theory of creep deformation of materials", ASME Trans., Journal of Applied Mechanics, Vol. 20, No. 2, 1957, pp. 245-252.
9. Plumbridge, W. J., "The analysis of creep data for solder alloys", Soldering and Surface Mount Technology, Vol. 15, No. 1, 2003, pp. 26-30.
10. Prager, M., "The Omega method: an engineering approach to life assessment", ASME Trans., Journal of Pressure Vessel Technology, August 2000, Vol. 122, pp. 273-280.
11. Schubert, A., Dudek, R., Auerswald, E., Gollhardt, A., Michel, B. and Reichl, H., "Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation", Proceedings (CD-ROM), IEEE 53rd Electronic Components and Technology Conference, New-Orleans, LA, May 27-30, 2003.
12. Shohji, I., Gagg, C. and Plumbridge, W. J., "Creep properties of Sn-8Mass%Zn3Mass%Bi lead-free alloy", Journal of Electronic Materials, Vol. 33, No. 8, August 2004, pp. 923-927.
13. Stouffer, D. C. and Dame, L. T., Inelastic deformations of metals: models, mechanical properties, and metallurgy, Wiley Interscience, 1996.
14. Wilshire, B., "Observations, theories, and predictions of high temperature creep behavior", Metallurgical and Materials Transactions A, Vol. 33A, February 2002, pp. 241-248.
15. Wu, C. M. L. and Huang, M. L., "Creep behavior of eutectic Sn-Cu lead-free solder alloy", Journal of Electronic Materials, Vol. 31, No. 5, 2002, pp. 442-448.