Backside TSV protrusion induced by thermal shock and thermal cycling

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2013, Pages 1407-1413

  Zhang, Dingyou ^a   Hummler, Klaus ^b   Smith, Larry ^b   Lu, James Jian Qiang ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GRAIN-BOUNDARY DIFFUSION; TEMPERATURE DEPENDENCE; THERMAL CYCLING TEST; THROUGH SILICON VIAS;

ACTIVATION ENERGY; GRAIN BOUNDARIES; THERMAL CYCLING; THERMAL SHOCK;

ELECTRONICS PACKAGING;

EID: 84883430191     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575757     Document Type: Conference Paper

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