Acceleration factor study of lead-free solder joints under wide range thermal cycling conditions

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1816-1822

  Ma, Hongtao ^a   Ahmad, Mudasir ^a   Liu, Kuo Chuan ^a  

^a CISCO SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED THERMAL CYCLING; ACCELERATION FACTORS; FAILURE MECHANISM; FAILURE RATE; LEAD-FREE SOLDER JOINT; SOLDER ALLOYS; SOLDER JOINTS; TEST CONDITION; TEST VEHICLE; WEIBULL STATISTICS;

LEAD; METALLURGY; QUALITY ASSURANCE; RELIABILITY ANALYSIS; SOLDERED JOINTS; TESTING; THERMAL CYCLING;

FAILURE ANALYSIS;

EID: 77955178790     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490719     Document Type: Conference Paper

References (8)

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8. Salmela,O., "Acceleration Factors for Lead-Free Solder Materials," IEEE Transactions on Components and Packaging Technologies, Vol.30, No.4, pp. 700-707, 2007.