Effects of dwell time and ramp rate on lead-free solder joints in FCBGA packages

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 901-906

  Fan, Xuejun ^a   Raiser, George ^a   Vasudevan, Vasu S ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

RAMP RATE; SOLDER MATERIAL; THERMAL SHOCKS;

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; LEAD; NUMERICAL ANALYSIS; RELIABILITY; THERMAL EFFECTS;

SOLDERED JOINTS;

EID: 24644450722     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

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