Wafer level MEMS packaging strategies

International Microelectronics and Packaging Society - 1st International Conference and Exhibition on Device Packaging 2005: Everything in Electronics Between the Chip and the System

Volumn , Issue , 2005, Pages 11-23

  Baldwin, Daniel F ^a  

^a Enabling Next Generation Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS PRODUCTS; DEVICE FABRICATIONS; MICRO ELECTRO MECHANICAL SYSTEM; MICROELECTRONICS PACKAGING; OPERATING ENVIRONMENT; PACKAGING SOLUTIONS; WAFER LEVEL BONDINGS; WAFER LEVEL PACKAGING;

CHIP SCALE PACKAGES; CONSUMER ELECTRONICS; EXHIBITIONS; LITHOGRAPHY; MEMS; MICROELECTRONICS; MICROSYSTEMS;

PACKAGING;

EID: 84878221203     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (48)

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