Modular, device-scale, direct-chip-attach packaging for microsystems

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 4, 2001, Pages 631-634

  Neysmith, Jordan ^b   Baldwin, Daniel F ^a,b  

^a IEEE   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Electronics packaging; Flip chip; MEMS; Microelectromechancial systems; Microsystems packaging; Optoelectronics packaging; Packaging

Indexed keywords

MICROSYSTEMS PACKAGING;

ASPECT RATIO; MICROELECTROMECHANICAL DEVICES; OPTICAL INTERCONNECTS; PHOTORESISTS; SILICON WAFERS; SURFACE MOUNT TECHNOLOGY;

CHIP SCALE PACKAGES;

EID: 0035694760     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.974952     Document Type: Article

References (12)

1. Re-configurable fluid circuits by PDMS elastomer micromachining
2. Wafer-to-wafer fusion bonding of oxidized silicon to silicon at low temperatures
3. 2 in integrated circuits
4. Localized bonding with PSG or indium solder as intermediate layer
5. Batch micropackaging by compression-bonded wafer-wafer transfer
6. Polymer bonding of micro-machined silicon structures
7. Eutectic Pb/Sn solder bump and under bump metallurgy interfacial reactions and adhesion
8. Wafer bonding with an adhesive coating
9. Vaccuum encapsulation of resonant devices using permeable polysilicon
10. 2 bonding with hydrofluoric acid: Room temperature and low stress bonding technique for MEMS
11. Packaging for MEMS and MST devices: The indent reflow sealing method