3D Si-on-Si stack package

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3830, Issue , 1999, Pages 248-253

  Kanbach, H ^a   Wilde, J ^a   Kriebel, F ^a   Meusel, E ^a  

^a DAIMLER AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; FLIP CHIP DEVICES; GOLD; INTERCONNECTION NETWORKS; METALLIZING; MICROPROCESSOR CHIPS; REACTIVE ION ETCHING; SEMICONDUCTING SILICON; SOLDERING ALLOYS; SUBSTRATES; THREE DIMENSIONAL; TUNGSTEN COMPOUNDS;

BUMP TECHNOLOGY; MULTI CHIP FLIP CHIP TECHNOLOGY; STACK PACKAGE DEMONSTRATOR; VIAS;

ELECTRONICS PACKAGING;

EID: 0033366570     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)