Stacking technology for a space constrained microsystem

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1998, Pages 312-317

  Heschel, M ^a   Kuhmann, J F ^a   Bouwstra, S ^a   Amskov, M ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MICROPROCESSOR CHIPS; SOLDERING; TRANSDUCERS;

CONDUCTIVE ADHESIVE BONDING; FLIP CHIP SOLDER BUMP BONDING;

ELECTRONICS PACKAGING;

EID: 0031703913     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)