Gallium alloy interconnects for flip-chip assembly applications

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 2, 2000, Pages 360-366

  Baldwin, Daniel F ^a   Deshmukh, Rajan D ^b   Hau, Christine S ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; INTERCONNECTION NETWORKS; LAMINATES; METALLOGRAPHIC MICROSTRUCTURE; NICKEL; PRINTED CIRCUIT BOARDS; RELIABILITY;

AMALGAMS; DIRECT CHIP ATTACH; FLIP CHIP ASSEMBLY; GALLIUM ALLOY INTERCONNECTS; INTERCONNECT MATERIALS; LEAD FREE MATERIALS;

GALLIUM ALLOYS;

EID: 0033706529     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.846775     Document Type: Article

References (10)

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