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Journal of Micromechanics and Microengineering

Volumn 8, Issue 2, 1998, Pages 69-73

Electrical characterization of anodically bonded wafers

(3) Cozma, A a Jakobsen, H b Puers, R a

a UNIVERSITY OF LEUVEN (Belgium)

b SensoNor as (Norway)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRIC BREAKDOWN OF SOLIDS; ELECTRIC CONDUCTIVITY; ELECTRIC DISCHARGES; LEAKAGE CURRENTS; SEMICONDUCTING GLASS; SEMICONDUCTOR JUNCTIONS; SURFACES;

ANODIC BONDING; GLASS WAFERS;

SILICON WAFERS;

EID: 0032093393 PISSN: 09601317 EISSN: None Source Type: Journal
DOI: 10.1088/0960-1317/8/2/006 Document Type: Article

Times cited : (15)

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11
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