MULTIPLE THROUGH-WAFER INTERCONNECTS FOR STACKING OF MICROSYSTEMS

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 1999-W, Issue , 1999, Pages 537-540

  Heschel, Matthias ^a   Rasmussen, Kurt ^b   Kuhmann, Jochen F ^a   Bouwstra, Siebe ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b Microtronic A/S   (Denmark)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; HEARING AIDS; INTEGRATED CIRCUIT INTERCONNECTS; METALLIZING; MICROPHONES; SILICON WAFERS; SOLDERING;

BONDING PADS; HEARING-AIDS; INTEGRATED CIRCUIT CHIPS; INTERCONNECT LAYERS; INTERCONNECT METALLIZATION; METALLISATION; STACKINGS; THROUGH HOLE; THROUGH-WAFER INTERCONNECTS; UNDER BUMP METALLIZATION;

METALS;

EID: 84878256870     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE1999-0317     Document Type: Conference Paper

References (11)

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