Combination of in situ straining and ACOM TEM: A novel method for analysis of plastic deformation of nanocrystalline metals

Ultramicroscopy

Volumn 128, Issue , 2013, Pages 68-81

  Kobler, A ^a,b   Kashiwar, A ^c,d   Hahn, H ^a,b   Kubel C ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^b DARMSTADT UNIVERSITY OF TECHNOLOGY   (Germany)

^c VISVESVARAYA NATIONAL INSTITUTE OF TECHNOLOGY   (India)

^d INDIAN INSTITUTE OF SCIENCE   (India)

Author keywords

ACOM TEM; Deformation mechanism; In situ straining; Nanocrystalline metals; Quantitative crystallographic analysis; STEM

Indexed keywords

ACOM-TEM; CRYSTALLOGRAPHIC ANALYSIS; DEFORMATION MECHANISM; IN-SITU STRAINING; NANOCRYSTALLINE METAL; STEM;

GOLD; GRAIN BOUNDARIES; GRAIN GROWTH; GRAIN SIZE AND SHAPE; PLASTIC DEFORMATION;

NANOCRYSTALLINE ALLOYS;

GOLD; METAL; NANOCRYSTALLINE METAL; UNCLASSIFIED DRUG;

ARTICLE; AUTOMATED CRYSTAL ORIENTATION MAPPING FOR TRANSMISSION ELECTRON MICROSCOPY; CRYSTAL STRUCTURE; FILM; IMAGE DISPLAY; MECHANICAL STRESS; METALLURGY; MICROWAVE OVEN; PHYSICAL CHEMISTRY; PHYSICAL PARAMETERS; PLASTIC DEFORMATION; RATING SCALE; STRESS STRAIN RELATIONSHIP; TRANSMISSION ELECTRON MICROSCOPY;

EID: 84875605849     PISSN: 03043991     EISSN: 18792723     Source Type: Journal    
DOI: 10.1016/j.ultramic.2012.12.019     Document Type: Article

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