Effect of annealing conditions on the grain size of nanocrystalline copper thin films

Materials Science Forum

Volumn 587-588, Issue , 2008, Pages 483-487

  Simoes S ^a   Calinas, R ^b   Ferreira, P J ^c   Vieira, M T ^b   Viana, F ^a   Vieira, M F ^a  

^a UNIVERSITY OF PORTO   (Portugal)

^b UNIVERSITY OF COIMBRA   (Portugal)

^c UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

Copper; Grain growth; Nanoindentation; Nanomaterials

Indexed keywords

ANNEALING; ATOMIC FORCE MICROSCOPY; COPPER; GRAIN GROWTH; GRAIN SIZE AND SHAPE; HARDNESS; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; METAL ANALYSIS; NANOCRYSTALLINE ALLOYS; NANOCRYSTALS; NANOINDENTATION; NANOSTRUCTURED MATERIALS; YIELD STRESS;

ABNORMAL GRAIN GROWTH; AS-DEPOSITED THIN FILMS; BIMODAL GRAIN-SIZE DISTRIBUTION; D.C. MAGNETRON SPUTTERING; NANOCRYSTALLINE COPPER; NANOCRYSTALLINE METAL; NANOCRYSTALLINE THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY OBSERVATION;

THIN FILMS;

EID: 60349123702     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.587-588.483     Document Type: Conference Paper

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