In situ TEM study of microplasticity and Bauschinger effect in nanocrystalline metals

Acta Materialia

Volumn 58, Issue 14, 2010, Pages 4772-4782

  Rajagopalan, Jagannathan ^a   Rentenberger, Christian ^b   Peter Karnthaler, H ^b   Dehm, Gerhard ^c   Saif, M Taher A ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b UNIVERSITY OF VIENNA   (Austria)

^c ERICH SCHMID INSTITUTE OF MATERIALS SCIENCE   (Austria)

Author keywords

Microstructural heterogeneity; Nanocrystalline materials; Plastic deformation; Thin films; Yield phenomena

Indexed keywords

ALUMINUM FILM; APPLIED STRAIN; BAUSCHINGER EFFECTS; DEFORMATION BEHAVIOR; DISLOCATION ACTIVITY; DISLOCATION GLIDE; GOLD FILM; IN-SITU TEM; IN-SITU TRANSMISSION; INTERNAL STRESS; MACROSCOPIC STRESS; MEAN-GRAIN SIZE; MECHANICAL BEHAVIOR; MICRO-PLASTIC DEFORMATION; MICRO-STRUCTURAL; MICROPLASTICITY; MICROSTRUCTURAL HETEROGENEITY; NANOCRYSTALLINE METAL; RANDOMLY ORIENTED GRAINS; SIMPLE MODEL; YIELD PHENOMENON;

ALUMINUM; GRAIN SIZE AND SHAPE; IN SITU PROCESSING; METALLIC FILMS; NANOCRYSTALLINE ALLOYS; PLASTIC DEFORMATION; SCANNING ELECTRON MICROSCOPY; STRAIN; STRENGTH OF MATERIALS; STRESS-STRAIN CURVES; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; UNLOADING;

NANOCRYSTALLINE MATERIALS;

EID: 77953872399     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2010.05.013     Document Type: Article

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