Innovative methodology for predictive reliability of intelligent power devices using extreme electro-thermal fatigue

Microelectronics Reliability

Volumn 45, Issue 9-11, 2005, Pages 1717-1722

  Khong, B ^a   Tounsi, P ^b   Dupuy, Ph ^c   Chauffleur, X ^d   Legros, M ^a   Deram, A ^c   Levade, C ^a   Vanderschaeve, G ^a   Dorkel, J M ^b   Fradin, J P ^d  

^a CEMES CNRS   (France)

^b LAAS CNRS   (France)

^c FREESCALE SEMICONDUCTOR INC   (United States)

^d NONE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE APPLICATIONS; INTELLIGENT POWER DEVICES; MECHANICAL MODELING; RELIABILITY MANAGEMENT;

AUTOMOTIVE ENGINEERING; DELAMINATION; ELECTRON MICROSCOPY; FAILURE ANALYSIS; FATIGUE OF MATERIALS; FATIGUE TESTING; INTELLIGENT AGENTS; MATHEMATICAL MODELS; MICROELECTRONICS; RELIABILITY; SOLDERING ALLOYS; THERMAL EFFECTS;

POWER SUPPLY CIRCUITS;

EID: 24144443892     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.07.104     Document Type: Conference Paper

References (5)

1. Kassakian JG. Automotive electrical systems-the power electronics market of the future. in: Applied Power Electronics Conference and Exposition (APEC 2000), 15th annual IEEE. 2000. New Orleans, LA, USA.
2. D.J. Perreault, and V. Caliskan Automotive Power Generation and Control IEEE Transactions on Power Electronics 19 3 2004
3. Liu, and Plumbridge Thermomechanical fatigue of Sn-37 wt.% Pb model solder joints Materials Science and Engineering A 362 2003 309 321
4. Bosc JM, Dupuy P, Gill J, Dorkel JM, Sarrabayrouse G. Thermal Characterization: A Key Element for Accelerating Stress Testing, 5th THERMINIC Workshop, 3-9 October 1999, Rome, Italy. pp. 299-304.
5. J.P. Fradin, and B. Desaunettes REBECA-3D: the thermal conductive solver for microelectronics Microelectronics Journal 29 9 1998 651 656