Advanced packaging yields higher performance and reliability in power electronics

Microelectronics Reliability

Volumn 50, Issue 9-11, 2010, Pages 1715-1719

  Bayerer, Reinhold ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADVANCED PACKAGING; AIR COOLED SYSTEMS; AMBIENT TEMPERATURES; CHIP TECHNOLOGY; COPPER WIRES; DIFFUSION SOLDERING; DYNAMIC PERFORMANCE; INTEGRATED HEAT; JUNCTION TEMPERATURES; LIQUID-COOLED SYSTEM; LONG LIFE; LOSS REDUCTION; OPERATION TEMPERATURE; POWER CHIPS; POWER CIRCUIT DESIGN; POWER DENSITIES; POWER DISSIPATION; POWER SEMICONDUCTORS;

CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; PACKAGING; SEMICONDUCTOR JUNCTIONS; SOLDERING; WIRE;

POWER ELECTRONICS;

EID: 80052829149     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.07.016     Document Type: Conference Paper

References (16)

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