Silver-indium transient liquid phase sintering for high temperature die attachment

Journal of Microelectronics and Electronic Packaging

Volumn 6, Issue 1, 2009, Pages 66-74

  Quintero, Pedro O ^a   Patrick McCluskey, F ^b  

^a UNIVERSITY OF PUERTO RICO   (Puerto Rico)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Die attach; DSC; High temperature; Reliability; Solder joint; Transient liquid phase sintering

Indexed keywords

DIES; DIFFERENTIAL SCANNING CALORIMETRY; ENERGY GAP; HIGH TEMPERATURE APPLICATIONS; LIQUIDS; PACKAGING MATERIALS; PROCESSING; RELIABILITY; SILVER; SINTERING; WIDE BAND GAP SEMICONDUCTORS;

DIE-ATTACH; ELECTRONIC PRODUCT; HIGH TEMPERATURE; HIGH TEMPERATURE SOLDERS; MECHANICAL INTEGRITY; PROCESSING TEMPERATURE; SOLDER JOINTS; TRANSIENT LIQUID PHASE SINTERING;

LIQUID PHASE SINTERING;

EID: 84870512295     PISSN: 15514897     EISSN: None     Source Type: Journal    
DOI: 10.4071/1551-4897-6.1.66     Document Type: Article

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