Migration of sintered nanosilver die-attach material on alumina substrate at high temperatures

International Conference and Exhibition on High Temperature Electronics 2010, HiTEC 2010

Volumn , Issue , 2010, Pages 26-31

  Mei, Yunhui ^a,b   Ibitayo, Dimeji ^c   Chen, Xu ^b   Luo, Susan ^d   Lu, Guo Quan ^a  

^a Virginia Polytechnic Institute and State University   (United States)

^b TIANJIN UNIVERSITY   (China)

^c U S ARMY RESEARCH LABORATORY   (United States)

^d NBE Technologies LLC   (United States)

Author keywords

High temperature die attach; Low temperature sintering; Nanosilver paste; Silver migration

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPIES (EDS); HIGH-TEMPERATURE DIE-ATTACH; HIGH-TEMPERATURE PACKAGING; LOW-TEMPERATURE SINTERING; NANO-SILVER PASTES; OXYGEN PARTIAL PRESSURE; PHENOMENOLOGICAL MODELS; SILVER MIGRATION;

CHIP SCALE PACKAGES; DIES; ELECTRIC FIELDS; ELECTRODES; ENERGY DISPERSIVE SPECTROSCOPY; HIGH TEMPERATURE APPLICATIONS; LEAKAGE CURRENTS; PARTIAL PRESSURE; POSITIVE IONS; SCANNING ELECTRON MICROSCOPY; SILVER; SINTERING; TEMPERATURE;

SINTERED ALUMINA;

EID: 84876908671     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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