Highly reliable nickel-tin transient liquid phase bonding technology for high temperature operational power electronics in electrified vehicles

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn , Issue , 2012, Pages 478-482

  Yoon, Sang Won ^a   Shiozaki, Koji ^a   Yasuda, Satoshi ^b   Glover, Michael D ^c  

^a Toyota Motor North America Inc   (United States)

^b TOYOTA MOTOR CORPORATION   (Japan)

^c University of Arkansas   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOY FORMATION; AUTOMOTIVE POWER ELECTRONICS; BONDING TECHNOLOGY; CONVENTIONAL POWER; HIGH RELIABILITY; HIGH TEMPERATURE; LARGE SIZES; LOW COSTS; OPERATIONAL POWER; POWER DEVICES; THERMAL CYCLE; TLP BONDING; TRANSIENT LIQUID PHASE BONDING;

EXHIBITIONS; HIGH TEMPERATURE OPERATIONS; LIQUIDS; SILICON CARBIDE; TIN; VEHICLES;

POWER ELECTRONICS;

EID: 84860198218     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2012.6165863     Document Type: Conference Paper

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