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Journal of Materials Science: Materials in Electronics

Volumn 19, Issue 3, 2008, Pages 275-280

The effects of third alloying elements on the bulk Ag 3Sn formation in slowly cooled Sn-3.5Ag lead-free solder

(5) Shen, Jun a Lai, Shiqiang a Liu, Yongchang b Gao, Houxiu b Wei, Jun c

a CHONGQING UNIVERSITY (China)

b TIANJIN UNIVERSITY (China)

c SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD-FREE SOLDER; THIRD ALLOYING ELEMENTS;

ALLOYING ELEMENTS; COPPER; INDIUM; INTERMETALLICS; THERMOANALYSIS; TIN ALLOYS; ZINC;

SEMICONDUCTING SILVER COMPOUNDS;

EID: 38949163627 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-007-9292-7 Document Type: Article

Times cited : (15)

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