Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish

Microelectronics Reliability

Volumn 51, Issue 2, 2011, Pages 445-452

  Lin, Hsiu Jen ^a,b   Chuang, Tung Han ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BGA PACKAGE; BONDING STRENGTH; CU-SN INTERMETALLICS; HETEROGENEOUS NUCLEATION; INTERFACIAL MICROSTRUCTURE; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; SNAGCU SOLDER; SOLDER BALLS; SOLDER JOINTS; SOLDER MATRIX; SURFACE FINISHES; TIN WHISKER; WHISKER GROWTH; ZN ATOMS;

DIFFUSION BONDING; FINISHING; INTERMETALLICS; MECHANICAL PROPERTIES; SILVER; SOLDERING; SOLDERING ALLOYS; ZINC;

TIN;

EID: 79551472380     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.07.061     Document Type: Conference Paper

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