Effect of Al content on the formation of intermetallic compounds in Sn-Ag-Zn lead-free solder

Journal of Materials Science: Materials in Electronics

Volumn 19, Issue 3, 2008, Pages 247-253

  Wan, J B ^a   Liu, Y C ^a   Wei, C ^a   Gao, Z M ^a   Ma, C S ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION CHANNELS; LEAD-FREE SOLDER;

ALLOYING; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; INTERMETALLICS; MORPHOLOGY; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 38949120860     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-007-9279-4     Document Type: Article

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