Thermal cycling reliability of Sn-Cu-Ni (-Ce) joints

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 31, Issue 2, 2010, Pages 36-40

  Wang, Jianxin ^a   Lai, Zhongmin ^a,b   Xue, Songbai ^b  

^a JIANGSU UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Intermetallic compound; Lead free solder; Mechanical property; Thermal cycling

Indexed keywords

CE ADDITION; GROWTH BEHAVIOR; IMC LAYER; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; LEAD-FREE SOLDER; PULL FORCE; QUAD FLAT PACKS; THERMAL CYCLING RELIABILITY;

CERIUM; CERIUM COMPOUNDS; LEAD; LEAD COMPOUNDS; MECHANICAL PROPERTIES; RELIABILITY; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TIN; TIN ALLOYS;

THERMAL CYCLING;

EID: 77951460385     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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