Effect of zinc additions on structure and properties of Sn-Ag eutectic lead-free solder alloy

Journal of Materials Science: Materials in Electronics

Volumn 19, Issue 1, 2008, Pages 81-84

  Kamal, Mustafa ^a   Gouda, El Said ^b  

^a Mansoura University   (Egypt)

^b NATIONAL RESEARCH CENTRE   (Egypt)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE STRENGTH; LEAD-FREE SOLDER ALLOY; VICKERS MICROHARDNESS;

BOND STRENGTH (MATERIALS); COMPOSITION EFFECTS; CONTACT ANGLE; ELASTIC MODULI; EUTECTICS; MICROHARDNESS; STRUCTURE (COMPOSITION); TIN ALLOYS; WETTING; ZINC;

SOLDERING ALLOYS;

EID: 37749032079     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-007-9289-2     Document Type: Article

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