메뉴 건너뛰기




Volumn 78, Issue 8, 2011, Pages 1794-1807

Notch effect on creep-fatigue life for Sn-3.5Ag solder

Author keywords

Circumferential notched specimen; Creep fatigue; Finite element analysis; Solder; Von Mises equivalent strain

Indexed keywords

CIRCUMFERENTIAL NOTCHED SPECIMEN; CRACK INITIATION LIFE; CREEP-FATIGUE; CREEP-FATIGUE CRACK; CREEP-FATIGUE DAMAGE; CREEP-FATIGUE LOADING; CROSS SECTION; EQUIVALENT STRAINS; FAILURE LIFE; FE ANALYSIS; FINITE ELEMENTS; MEAN VALUES; MULTIAXIAL STRAIN; NOTCH-ROOT; NOTCHED SPECIMENS; SN-3.5AG SOLDERS; SOLDER; STRAIN WAVEFORM; VON MISES; VON MISES EQUIVALENT STRAIN;

EID: 79958033752     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.engfracmech.2011.02.001     Document Type: Article
Times cited : (15)

References (16)
  • 1
    • 0026173560 scopus 로고
    • Low cycle fatigue of Sn96 solder with reference to eutectic solder and a high Pb solder
    • Solomon H.D. Low cycle fatigue of Sn96 solder with reference to eutectic solder and a high Pb solder. ASME J Electron Packag 1991, 113(2):102-108.
    • (1991) ASME J Electron Packag , vol.113 , Issue.2 , pp. 102-108
    • Solomon, H.D.1
  • 2
    • 0029352931 scopus 로고
    • Multiaxial low cycle fatigue of 63Sn-37Pb solder
    • Yamamoto T., Sakane M., Ohnami M., Yamada T. Multiaxial low cycle fatigue of 63Sn-37Pb solder. J Soc Mater Sci Jpn 1995, 44(503):1080-1085.
    • (1995) J Soc Mater Sci Jpn , vol.44 , Issue.503 , pp. 1080-1085
    • Yamamoto, T.1    Sakane, M.2    Ohnami, M.3    Yamada, T.4
  • 3
    • 0036575439 scopus 로고    scopus 로고
    • Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders
    • Kanchanomai C., Miyashita Y., Mutoh Y. Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders. J Electron Mater 2002, 31(5):456-465.
    • (2002) J Electron Mater , vol.31 , Issue.5 , pp. 456-465
    • Kanchanomai, C.1    Miyashita, Y.2    Mutoh, Y.3
  • 6
    • 0037409962 scopus 로고    scopus 로고
    • Time-dependent cyclic deformation and failure of 63Sn/37Pb solder alloy
    • Yang X.J., Chow C.L., Lau K.J. Time-dependent cyclic deformation and failure of 63Sn/37Pb solder alloy. Int J Fatigue 2003, 25(6):533-546.
    • (2003) Int J Fatigue , vol.25 , Issue.6 , pp. 533-546
    • Yang, X.J.1    Chow, C.L.2    Lau, K.J.3
  • 7
    • 29544432309 scopus 로고    scopus 로고
    • A strain rate ratio approach for assessing creep-fatigue life of 63Sn-37Pb solder under shear loading
    • Tsukada Y., Nishimura H., Yamamoto H., Sakane M. A strain rate ratio approach for assessing creep-fatigue life of 63Sn-37Pb solder under shear loading. ASME J Electron Packag 2005, 127(4):407-414.
    • (2005) ASME J Electron Packag , vol.127 , Issue.4 , pp. 407-414
    • Tsukada, Y.1    Nishimura, H.2    Yamamoto, H.3    Sakane, M.4
  • 9
    • 47049114210 scopus 로고    scopus 로고
    • Notch effect on low cycle fatigue of Sn-3.5Ag solder
    • 011001-1-011001-7
    • Nozaki M., Sakane M., Tsukada Y. Notch effect on low cycle fatigue of Sn-3.5Ag solder. ASME J Engng Mater Tech 2008, 130(1):011001-1-011001-7.
    • (2008) ASME J Engng Mater Tech , vol.130 , Issue.1
    • Nozaki, M.1    Sakane, M.2    Tsukada, Y.3
  • 10
    • 44749091791 scopus 로고    scopus 로고
    • Crack propagation behavior of Sn-3.5Ag solder in low cycle fatigue
    • Nozaki M., Sakane M., Tsukada Y. Crack propagation behavior of Sn-3.5Ag solder in low cycle fatigue. Int J Fatigue 2008, 30(10-11):1729-1736.
    • (2008) Int J Fatigue , vol.30 , Issue.10-11 , pp. 1729-1736
    • Nozaki, M.1    Sakane, M.2    Tsukada, Y.3
  • 11
    • 79958036755 scopus 로고    scopus 로고
    • JSMS Committee on High Temperature Strength of Materials. Creep-fatigue standard for solder testing
    • JSMS Committee on High Temperature Strength of Materials. Creep-fatigue standard for solder testing. Jpn: Jpn Soc Mater Sci; 2004.
    • (2004) Jpn: Jpn Soc Mater Sci
  • 12
    • 79958074895 scopus 로고    scopus 로고
    • JSMS Committee on High Temperature Strength of Materials. Factual database on creep and creep-fatigue properties of Sn-37Pb and Sn-3.5Ag solders
    • JSMS Committee on High Temperature Strength of Materials. Factual database on creep and creep-fatigue properties of Sn-37Pb and Sn-3.5Ag solders. Jpn: Jpn Soc Mater Sci; 2004.
    • (2004) Jpn: Jpn Soc Mater Sci
  • 13
    • 79958071087 scopus 로고
    • ISIJ Committee on High Temperature Strength of Materials. Notch effect on low cycle fatigue in creep-fatigue at high temperatures: experiment and FEM analysis. The Iron and Steel Institute of Japan
    • ISIJ Committee on High Temperature Strength of Materials. Notch effect on low cycle fatigue in creep-fatigue at high temperatures: experiment and FEM analysis. The Iron and Steel Institute of Japan; 1985.
    • (1985)
  • 14
    • 0024052933 scopus 로고
    • Electrical potential drop and notch opening displacement methods for detecting high temperature low cycle fatigue cracks of circumferential notched specimens
    • Sakane M., Ohnami M. Electrical potential drop and notch opening displacement methods for detecting high temperature low cycle fatigue cracks of circumferential notched specimens. ASME J Engng Mater Technol 1988, 110(3):247-252.
    • (1988) ASME J Engng Mater Technol , vol.110 , Issue.3 , pp. 247-252
    • Sakane, M.1    Ohnami, M.2
  • 15
    • 0242368181 scopus 로고    scopus 로고
    • Crack initiation and propagation behavior of three types of solders in torsion low cycle fatigue
    • Nose H., Sakane M., Yamashita M., Shiokawa K. Crack initiation and propagation behavior of three types of solders in torsion low cycle fatigue. Trans Jpn Soc Mech Engng Ser A 2003, 69(684):1222-1229.
    • (2003) Trans Jpn Soc Mech Engng Ser A , vol.69 , Issue.684 , pp. 1222-1229
    • Nose, H.1    Sakane, M.2    Yamashita, M.3    Shiokawa, K.4
  • 16
    • 0022795297 scopus 로고
    • Notch effect in low-cycle fatigue at elevated temperatures - life prediction from crack initiation and propagation considerations
    • Sakane M., Ohnami M. Notch effect in low-cycle fatigue at elevated temperatures - life prediction from crack initiation and propagation considerations. ASME J Engng Mater Technol 1986, 108(4):279-284.
    • (1986) ASME J Engng Mater Technol , vol.108 , Issue.4 , pp. 279-284
    • Sakane, M.1    Ohnami, M.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.