Reliability of high temperature lead-free solder alternative

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 444-447

  McCluskey, F P ^a   Wang, Z ^a   Dash, M ^a   Huff, D ^b  

^a UNIVERSITY OF MARYLAND   (United States)

^b VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL REGULATIONS; HIGH TEMPERATURE OPERATIONS; LEAD; RELIABILITY ANALYSIS; TOXICITY;

HIGH TEMPERATURE SOLDERS; SOLDER MATERIALS;

SOLDERING ALLOYS;

EID: 42549154716     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280040     Document Type: Conference Paper

References (3)

1. Zhiye Zhang and Guo-Quan Lu, "Pressure-Assisted Low-Temperature Sintering of Silver Paste as an Alternative Die-Attach Solution to Solder Reflow," IEEE Transactions on Electronics Packaging Manufacturing, Vol.23, No. 4, Oct. 2002, pp.279-283.
2. Guo-Quan Lu, Jesus Noel Calata, Zhiye Zhang, and John G Bai, "A Lead-Free, Low-Temperature Sintering Die-Attach Technique for High-Temperature Packaging," Proceeding of HDP, 2004, pp. 42-46.
3. Zhiye Zhang, Jesus Noel Calata, John G Bai, and Guo-Quan Lu, "Nanoscale Silver Sintering for High-Temperature Packaging of Semiconductor Devices," Materials Processing and Manufacturing Division Fifth Global Symposium, TMS, 2004, pp. 129-135.