Effect of Ag 3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

Corrosion Science

Volumn 63, Issue , 2012, Pages 20-28

  Wang, Mingna ^a   Wang, Jianqiu ^a   Feng, Hao ^b   Ke, Wei ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

^b China National Electric Apparatus Research Institute   (China)

Author keywords

A. Alloy; A. Electronic materials; B. SEM; B. XPS; C. Atmospheric corrosion

Indexed keywords

COOLING RATES; ELECTRONIC MATERIALS; HIGH TEMPERATURE; SN-3.0AG-0.5CU; SOLDER ALLOYS;

ATMOSPHERIC CORROSION; COOLING SYSTEMS; CORROSION RESISTANCE; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 84864291990     PISSN: 0010938X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.corsci.2012.05.006     Document Type: Article

References (29)

1. Han C.F., Liu Q., Ivey D.G. Electrochemical composite deposition of Sn-Ag-Cu alloys. Mater. Sci. Eng. B. 2009, 164:172-179.
2. Bai N., Chen X. A new unified constitutive model with short- and longrange back stress for lead-free solders of Sn-3Ag-0.5Cu and Sn-0.7Cu. Int. J. Plast. 2009, 25:2181-2203.
3. Janne J.S., Sami T.N., Toivo K.L., Eero O.R. Mechanical and microstructural properties of SnAgCu solder joints. Mater. Sci. Eng. A. 2006, 420:55-62.
4. Kanlayasiri K., Ariga T. Influence of thermal aging on microhardness and microstructure of Sn-0.3Ag-0.7Cu-xIn lead-free solders. J. Alloys Compd. 2010, 504:L5-L9.
5. Islam M.N., Chan Y.C., Sharif A., Rizvi M.J. Effect of 9wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads. J. Alloys Compd. 2005, 396:217-223.
6. Herkommer D., Punch J., Reid M. A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions. Microelectron. Reliab. 2010, 50:116-126.
7. Li D.Z., Conway P.P., Liu C.Q. Corrosion characterization of tin-lead and lead free solders in 3.5wt.% NaCl solution. Corros. Sci. 2008, 50:995-1004.
8. Mori M., Miura K., Sasaki T. Corrosion of tin alloys in sulfuric and nitric acids. Corros. Sci. 2002, 44:887-898.
9. Rosalbino F., Angelini E., Zanicchi G., Carlini R., Marazza R. Electrochemical corrosion study of Sn-3Ag-3Cu solder alloy in NaCl solution. Electrochim. Acta. 2009, 54:7231-7325.
10. Mohanty U.S., Lin K.L. Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-XAg-0.1 Al-0.5 Ga solder in 3.5% NaCl solution. Mater. Sci. Eng. A. 2005, 406:34-42.
11. Mohanty U.S., Lin K.L. Electrochemical corrosion behaviour of Pb-free Sn-8.5Zn-0.05Al-XGa and Sn-3Ag-0.5Cu alloys in chloride containing aqueous solution. Corros. Sci. 2008, 50:2437-2443.
12. Wislei R.O., Leonardo R.G., Leandro C.P., Amauri G. Electrochemical behavior of a lead-free SnAg solder alloy affected by the microstructure array. Mater. Des. 2011, 32:4763-4772.
13. 3Sn plates in SnAgCu solder bumps. Mater. Sci. Eng. A. 2010, 527:2588-2591.
14. Wang M.N., Wang J.Q., Feng H., Ke W. Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder. J Mater Sci: Mater Electron. 2012, 23:148-155.
15. 4 solutions. Microelectron. Eng. 2008, 85:1597-1602.
16. Hung F.Y., Lin H.M., Chen P.S., Lui T.S., Chen L.H. A study of the thin film on the surface of Sn-3.5Ag/Sn-3.5Ag-2.0Cu lead-free alloy. J. Alloys Compd. 2006, 415:85-92.
17. Zhang S.S., Zhang Y.J., Wang H.W. Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes. J. Alloys Compd. 2009, 487:682-686.
18. Sasaki T., Kanagawa R., Ohtsuka T., Miura K. Corrosion products of tin in humid air containing sulfur dioxide and nitrogen dioxide at room temperature. Corros. Sci. 2003, 45:847-854.
19. Moon K.W., Boettinger W.J., Kattner U.R., BiancanielloI F.S., Handwerker C.A. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys. J. Electron. Mater. 2000, 29:1122-1136.
20. Shen J., Chan Y.C., Liu S.Y. Growth mechanism of bulk Ag3Sn intermetallic compounds in Sn-Ag solder during solidification. Intermetallics 2008, 16:1142-1148.
21. Swenson D. The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints. J. Mater. Sci.: Mater Electron. 2007, 18:39-54.
22. 3Sn in Sn-Ag-Cu alloys and their influence on the vibration fracture properties. Mater. Sci. Eng. A. 2007, 466:9-17.
23. Kim K.S., Huh S.H., Suganuma K. Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys. Mater. Sci. Eng. A. 2002, 333:106-114.
24. Lee H.T., Chen Y.F. Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn-3.5Ag solder. J. Alloys Compd. 2011, 509:2510-2517.
25. Bian L., Weng Y.J., Li X.Y. Observation of micro-droplets on metal surface in early atmospheric corrosion. Electrochem. Commun. 2005, 7:1033-1038.
26. Chang H., Chen H.T., Li M.Y., Wang L., Fu Y.G. Generation of Tin(II) oxide crystals on lead-free solder joints in deionized water. J. Electron. Mater. 2009, 38:2712-2717.
27. Bui Q.V., Nam N.D., Noh B.I., Kar A., Kim J.G., Jung S.B. Effect of Ag addition on the corrosion properties of Sn-based solder alloys. Mater. Corros. 2009, 61:30-33.
28. Dudek M.A., Chawla N. Oxidation behavior of rare-earth-containing Pb-free solders. J. Electron. Mater. 2009, 38:210-220.
29. Gervasi C.A., Alvarez P.E., Fiori Bimbi M.V., Folquer M.E. Comparative cyclic voltammetry and SEM analysis of tin electrodes in citrate buffer solutions. J. Electroanal. Chem. 2007, 601:194-204.