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Volumn 61, Issue 1, 2010, Pages 30-33
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Effect of Ag addition on the corrosion properties of Sn-based solder alloys
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Author keywords
[No Author keywords available]
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Indexed keywords
AG ADDITIONS;
AS-CAST;
CHARGE TRANSFER RESISTANCE;
CORROSION POTENTIALS;
CORROSION PROPERTY;
CORROSIVE ENVIRONMENT;
IMAGE ANALYSIS TECHNIQUES;
LEAD-FREE SOLDER ALLOY;
PITTING POTENTIAL;
POTENTIODYNAMIC TESTS;
SEM;
SN-BASED SOLDERS;
SOLDER ALLOYS;
ALLOYS;
CERIUM ALLOYS;
CHARGE TRANSFER;
CORROSION RESISTANCE;
ELECTROCHEMICAL CORROSION;
ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY;
IMAGE ANALYSIS;
ION EXCHANGE;
LEAD;
SCANNING ELECTRON MICROSCOPY;
SILVER;
SILVER ALLOYS;
SODIUM;
SOLDERING ALLOYS;
TIN ALLOYS;
X RAY DIFFRACTION;
TIN;
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EID: 74549193427
PISSN: 09475117
EISSN: 15214176
Source Type: Journal
DOI: 10.1002/maco.200905237 Document Type: Article |
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Times cited : (32)
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References (16)
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