Electrochemical composite deposition of Sn-Ag-Cu alloys

Materials Science and Engineering: B

Volumn 164, Issue 3, 2009, Pages 172-179

  Han, Chunfen ^a   Liu, Qi ^a   Ivey, Douglas G ^a  

^a UNIVERSITY OF ALBERTA   (Canada)

Author keywords

Copper; Electrodeposition; Scanning electron microscopy; Silver; Thin films; Tin

Indexed keywords

BINARY ALLOYS; COMPOSITE FILMS; COPPER ALLOYS; COPPER COMPOUNDS; ELECTROCHEMICAL DEPOSITION; ELECTRODES; EUTECTICS; LEAD ALLOYS; LEAD-FREE SOLDERS; SILVER ALLOYS; TERNARY ALLOYS; TIN ALLOYS; TIN COMPOUNDS;

AG PARTICLES; CITRATE SOLUTIONS; COMPOSITE DEPOSITION; ELECTROCHEMICALS; ELECTRONIC ASSEMBLIES; NEAR-EUTECTIC SN-AG-CU SOLDERS; PB FREE SOLDERS; PLATING CONDITIONS; SIMPLE++; THIN-FILMS;

SCANNING ELECTRON MICROSCOPY;

EID: 71749085208     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2009.09.012     Document Type: Article

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