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Volumn 54, Issue 28, 2009, Pages 7231-7235
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Electrochemical corrosion study of Sn-3Ag-3Cu solder alloy in NaCl solution
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Author keywords
Electrochemical impedance spectroscopy (EIS); NaCl solution; Pb free alloys; Polarization curves; Tin oxyhydroxychlorides
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Indexed keywords
CORROSION BEHAVIOUR;
CORROSION PRODUCTS;
CU ALLOY;
ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY (EIS);
ELECTROCHEMICAL TEST;
IMPEDANCE SPECTROSCOPY MEASUREMENTS;
MICROELECTRONIC COMPONENTS;
NACL SOLUTION;
OXYCHLORIDES;
PB-FREE ALLOYS;
POLARIZATION CURVES;
SEM;
SOLDER ALLOYS;
ALLOYS;
COPPER ALLOYS;
CORROSION RESISTANCE;
CORROSIVE EFFECTS;
ELECTROCHEMICAL CORROSION;
ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY;
ELECTRON PROBE MICROANALYSIS;
LEAD;
POLARIZATION;
SCANNING ELECTRON MICROSCOPY;
SILVER;
SILVER ALLOYS;
SODIUM CHLORIDE;
TIN ALLOYS;
TIN;
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EID: 70349483909
PISSN: 00134686
EISSN: None
Source Type: Journal
DOI: 10.1016/j.electacta.2009.07.030 Document Type: Article |
Times cited : (88)
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References (31)
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