Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaCl and Na2SO4 solutions

Microelectronic Engineering

Volumn 85, Issue 7, 2008, Pages 1597-1602

  Jung, Ja Young ^a   Lee, Shin Bok ^b   Joo, Young Chang ^b   Lee, Ho Young ^c   Park, Young Bae ^a  

^a Andong National University   (South Korea)

^b Seoul National University   (South Korea)

^c Sungkyunkwan University   (South Korea)

Author keywords

Anodic dissolution; Electrochemical migration; Life time; Na2SO4; NaCl; Sn solder

Indexed keywords

DISSOLUTION; ELECTROCHEMISTRY; SODIUM CHLORIDE; THIN FILMS; TIN COMPOUNDS;

ANODIC DISSOLUTION; ELECTROCHEMICAL MIGRATION; LIFE TIME; PASSIVE FILMS;

SOLDERING;

EID: 46549084168     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.03.015     Document Type: Article

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