Evolution of Ag3Sn intermetallic compounds during solidification of eutectic Sn-3.5Ag solder

Journal of Alloys and Compounds

Volumn 509, Issue 5, 2011, Pages 2510-2517

  Lee, Hwa Teng ^a   Chen, Yin Fa ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Ag3Sn; Cooling rate; Cu6Sn 5; Plate like; Sn 3.5Ag

Indexed keywords

AG3SN; COOLING RATE; CU6SN 5; PLATE-LIKE; SN-3.5AG;

COOLING; EUTECTICS; INTERMETALLICS; MORPHOLOGY; NEEDLES; SILVER; SOLDERING ALLOYS; SOLIDIFICATION;

TIN;

EID: 78651358307     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.11.068     Document Type: Article

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