Electrochemical behavior of a lead-free SnAg solder alloy affected by the microstructure array

Materials and Design

Volumn 32, Issue 10, 2011, Pages 4763-4772

  Osório, Wislei R ^a   Garcia, Leonardo R ^a   Peixoto, Leandro C ^a   Garcia, Amauri ^a  

^a UNIVERSITY OF CAMPINAS   (Brazil)

Author keywords

A. Non ferrous metals and alloys; C. Casting; E. Corrosion

Indexed keywords

C. CASTING; COOLING RATES; E. CORROSION; ELECTROCHEMICAL BEHAVIORS; ELECTROCHEMICAL CORROSION BEHAVIOR; ELECTROCHEMICAL PARAMETERS; LEAD-FREE; LOCAL SOLIDIFICATION; MATRIX; METALLIC MOLD; MICROSTRUCTURAL CHARACTERISTICS; MICROSTRUCTURE ARRAYS; NACL SOLUTION; NONFERROUS METALS AND ALLOYS; POTENTIODYNAMIC POLARIZATION CURVES; SLOW COOLING; SN-AG SOLDER;

COOLING; CORROSION RESISTANCE; ELECTRIC NETWORK ANALYSIS; ELECTROCHEMICAL CORROSION; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; INTERMETALLICS; METALLURGY; MICROSTRUCTURE; MORPHOLOGY; RATING; SILVER; SILVER ALLOYS; SODIUM CHLORIDE; SOLDERING ALLOYS; SOLIDIFICATION; TIN ALLOYS;

TIN;

EID: 79960906201     PISSN: 02641275     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2011.06.032     Document Type: Article

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