Finite element stress analysis of thin die detachment process

ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings

Volumn , Issue , 2003, Pages 44-51

  Chong, A C M ^a   Cheung, Y M ^a  

^a ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

Assembly; Electronics packaging; Finite element methods; Microassembly; Pins; Plastic films; Production; Semiconductor device packaging; Semiconductor devices; Stress

Indexed keywords

ASSEMBLY; CHIP SCALE PACKAGES; DIES; FINITE ELEMENT METHOD; PLASTIC ADHESIVES; PLASTIC FILMS; PRODUCTION; SEMICONDUCTOR DEVICES; STRESS ANALYSIS; STRESSES;

3D FINITE ELEMENT MODEL; ASSEMBLY PROCESS; ELECTRONIC PACKAGING; FINITE ELEMENT STRESS ANALYSIS; MICRO ASSEMBLY; PINS; PRODUCTION YIELD; SEMICONDUCTOR DEVICE PACKAGING;

ELECTRONICS PACKAGING;

EID: 84946411027     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1298691     Document Type: Conference Paper

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