Roll-to-roll processing of flexible heterogeneous electronics with low interfacial residual stress

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 9, 2011, Pages 1368-1377

  Huang, Yongan ^a   Chen, Jiankui ^a   Yin, Zhouping ^a   Xiong, Youlun ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Collaborative optimization; flexible electronics; interfacial stress; roll to roll processing; thermomechanical modeling

Indexed keywords

CO-OPTIMIZATION; COLLABORATIVE OPTIMIZATION; DEVICE STRUCTURES; GENERALIZED PLANE STRAIN THEORY; GEOMETRICAL DIMENSIONS; HIGH-THROUGHPUT; INTERFACIAL SHEAR; INTERFACIAL STRESS; MATERIAL PROPERTY; MISFIT STRAINS; MULTIVARIABLE OPTIMIZATION; NON-LINEAR PHENOMENA; PEELING STRESS; PROCESS PARAMETERS; PROCESS TEMPERATURE; ROLL TO ROLL; ROLL-TO-ROLL PROCESSING; STRUCTURAL DIMENSIONS; TEMPERATURE-DEPENDENT PROPERTIES; THERMOMECHANICAL MODELING; WEB TENSION;

OPTIMIZATION; RESIDUAL STRESSES; SUBSTRATES;

FLEXIBLE ELECTRONICS;

EID: 84859793205     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2157692     Document Type: Article

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